| Analysis and optimization of TSV–TSV coupling in three-dimensional integrated circuits |
| 赵颖博;董刚;杨银堂; |
| 关键词：3D integration;though silicon vias(TSVs) |
| 主要内容：Through silicon via(TSV)-TSV coupling is detrimental to the performance of three-dimensional(3D)integrated circuits(ICs) |
| 《Journal of Semiconductors》 2015,36(04):176-183 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
微信公众号