| Optimized Mid-bond Order for 3D-Stacked ICs Considering Failed Bonding |
| LIANG Huaguo;CHANG Hao;LI Yang;WANG Wei; |
| 关键词：3D-Stacked ICs;Through silicon via(TSV); |
| 主要内容：One notable difference between 3D test flow and 2D test flow mainly lies in the mid-bond test, in which the stacking yie |
| 《Chinese Journal of Electronics》 2015,24(02):223-228 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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