| Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV |
| Tanu Goyal;Manoj Kumar Majumder;Brajesh |
| 关键词：carbon nanotube;through-silicon vias;equ |
| 主要内容：Through-silicon vias(TSVs) have provided an attractive solution for three-dimensional(3D) integrated devices and circuit |
| 《Journal of Semiconductors》 2015,36(06):103-108 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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