| Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu_ENEPIG Joints |
| M.L.Huang;F.Yang; |
| 关键词：Size effect Lead-free solder Interfacial |
| 主要内容：Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Ag |
| 《Journal of Materials Science & Technolog》 2015,31(03):252-256 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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