| Transient thermal analysis as measurement method for IC package structural integrity |
| Alexander Han;Maximilian Schmid;E Liu;G |
| 关键词：transient thermal analysis;thermal resis |
| 主要内容：Practices of IC package reliability testing are reviewed briefly,and the application of transient thermal analysis is ex |
| 《Chinese Physics B》 2015,24(06):51-68 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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