| Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex(UTCOF) assembly |
| CHEN JianKui;XU ZhouLong;HUANG YongAn;DU |
| 关键词：microelectronic packaging;warpage;layerw |
| 主要内容：The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly |
| 《Science China(Technological Sciences)》 2016,59(11):1646-1655 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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