| Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer |
| 任晓黎;庞诚;秦征;平野;姜峰;薛恺;刘海燕;于大全; |
| 关键词：interposer;TSV(through-silicon vias);RDL |
| 主要内容：An interposer test vehicle with TSVs(through-silicon vias) and two redistribute layers(RDLs) on the top side for 2.5D in |
| 《Journal of Semiconductors》 2016,37(04):117-123 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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