| Novel through-silicon vias for enhanced signal integrity in 3D integrated systems |
| 方孺牛;孙新;缪旻;金玉丰; |
| 关键词：through-silicon-vias;crosstalk;MOS capac |
| 主要内容：In this paper, a new type of through-silicon via(TSV) for via-first process namely bare TSV, is proposed and analyzed wi |
| 《Journal of Semiconductors》 2016,37(10):97-102 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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