| Optimal design analysis for thermal performance of high power 2.5D package |
| 刘晓阳;马鹤;于大全;陈文录;吴小龙; |
| 关键词：2;5D package;high power;thermal design;A |
| 主要内容：Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the |
| 《Journal of Semiconductors》 2016,37(03):114-118 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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