| Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits |
| 刘晓贤;朱樟明;杨银堂;丁瑞雪;李跃进; |
| 关键词：three-dimensional integrated circuits;th |
| 主要内容：In this paper,ground-signal-ground type through-silicon vias(TSVs) exploiting air gaps as insulation layers are designed |
| 《Chinese Physics B》 2016,25(11):623-628 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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