| Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic |
| Yazhou Zhang;Guifu Ding;Hong W |
| 关键词：Cu micro-cylinder electrodeposition;Electron back- |
| 主要内容：Microstructure and texture of electrodeposited Cu micro-cylinders in the blind hole play a vitally important role in the electrical and mechanical pro |
| 《Journal of Materials Science & Technology》 2016(4).355-361 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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