| Passive Alignment Method of Polymer PLC Devices by Using a Hot Embossing Technique |
| Jin Tae Kim |
| 关键词：Hot embossing, passive alignment, polymer planar lightwave circuit (PLC) |
| 主要内容：A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices.With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of 0.5 m. This process reduces the steps for fabricating alignment structures.Afabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices... |
| 《2004 IEEE》 |
| 全文下载请进入http://hightech.stlib.cn/tpi_1/sysasp/include/index.asp |
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