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  • 印制电路板在板级跌落冲击的易损度探究
  • 作者:刘宏;    来源期刊:包装工程    年卷号:2015,36(17):84-86+99
  • 摘要:目的研究标准冲击载荷下印制电路板的挠度响应以及各参数对电路板脆值的影响。方法考虑印制电路板在三角脉冲下的跌落冲击,将四边点支的电路板简化成梁的模型。将脉冲激励考虑为内在的位移,建立模型求解电路板的挠度和加速度响应,进而与电路板的本身特性比较

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  • Progress in complementary metal–oxide–semiconducto...
  • 作者:陈弘达;张赞;黄北举;毛陆虹;张赞允;    来源期刊:Journal of Semiconductors    年卷号:2015,36(12):5-17
  • 摘要:Silicon photonics is an emerging competitive solution for next-generation scalable data communications in different appl

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  • A prediction technique for single-event effects on...
  • 作者:赵元富;于春青;范隆;岳素格;陈茂鑫;杜...    来源期刊:Journal of Semiconductors    年卷号:2015,36(11):88-92
  • 摘要:The sensitivity of complex integrated circuits to single-event effects is investigated. Sensitivity depends not only on

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  • The single-event effect evaluation technology for ...
  • 作者:郑宏超;赵元富;岳素格;范隆;杜守刚;陈...    来源期刊:Journal of Semiconductors    年卷号:2015,36(11):83-87
  • 摘要:Single-event effects of nano scale integrated circuits are investigated. Evaluation methods for singleevent transients,

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  • Analysis and RHBD technique of single event transi...
  • 作者:韩志伟;王亮;岳素格;韩兵;杜守刚;    来源期刊:Journal of Semiconductors    年卷号:2015,36(11):79-82
  • 摘要:Single-event transient susceptibility of phase-locked loops has been investigated. The charge pump is the most sensitive

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